| Element | |
|---|---|
29CuCopper63.54632
8 18 1 |
|
| Basic properties | |
|---|---|
| Atomic number | 29 |
| Atomic weight | 63.5463 amu |
| Element family | Transition metals |
| Period | 4 |
| Group | 1 |
| Block | s-block |
| Discovery year | 9000 BC |
| Isotope distribution |
|---|
63Cu 69.17% 65Cu 30.83% |
63Cu (69.17%) 65Cu (30.83%) |
| Physical properties | |
|---|---|
| Density | 8.933 g/cm3 (STP) |
Atomic hydrogen (H) 8.988E-5 Meitnerium (Mt) 28 | |
| Melting | 1084.6 °C |
Helium (He) -272.2 Carbon (C) 3675 | |
| Boiling | 2595 °C |
Helium (He) -268.9 Tungsten (W) 5927 | |
| Chemical properties | |
|---|---|
| Oxidation states (less common) | +2 (-2, -1, 0, +1, +3, +4) |
| First ionization potential | 7.726 eV |
Cesium (Cs) 3.894 Helium (He) 24.587 | |
| Electron affinity | 1.236 eV |
Nobelium (No) -2.33 Atomic chlorine (Cl) 3.612725 | |
| Electronegativity | 1.9 |
Cesium (Cs) 0.79 Atomic fluorine (F) 3.98 | |
| Atomic radius | |
|---|---|
| Covalent radius | 1.12 Å |
Atomic hydrogen (H) 0.32 Francium (Fr) 2.6 | |
| Van der Waals radius | 1.4 Å |
Atomic hydrogen (H) 1.2 Francium (Fr) 3.48 | |
| Metallic radius | 1.28 Å |
Beryllium (Be) 1.12 Cesium (Cs) 2.65 | |
| Compounds | ||
|---|---|---|
| Formula | Name | Oxidation state |
| Cu2O | Copper(i) oxide | +1 |
| CuCl | Copper(i) chloride | +1 |
| Cu2S | Copper(i) sulfide | +1 |
| CuI | Copper(i) iodide | +1 |
| CuCN | Copper(I) cyanide | +1 |
| CuBr | Copper(i) bromide | +1 |
| CuSO4 | Copper(II) sulfate | +2 |
| CuCl2 | Copper(II) chloride | +2 |
| Cu(NO3)2 | Copper(II) nitrate | +2 |
| CuO | Copper(II) oxide | +2 |
| Cu(OH)2 | Copper(II) hydroxide | +2 |
| Cs2CuF6 | Caesium hexafluorocuprate(IV) | +4 |
| Electronic properties | |
|---|---|
| Electrons per shell | 2, 8, 18, 1 |
| Electronic configuration | [Ar] 3d10 |
|
Bohr atom model
| |
|
Orbital box diagram
| |
| Valence electrons | 11 |
| Lewis dot structure |
|
| Orbital Visualization | |
|---|---|
|
| |
| Electrons | - |
Copper (Cu): Periodic Table Element
Abstract
Copper exhibits exceptional electrical and thermal conductivity properties that establish its significance as an industrial metal and chemical element. The element demonstrates characteristic d10 electronic configuration, resulting in distinct physical and chemical behaviors including diamagnetic properties and variable oxidation states. Copper manifests in crystalline face-centered cubic structure with atomic number 29 and atomic weight 63.546 u. The metal exhibits two primary oxidation states, +1 and +2, with cupric compounds displaying characteristic blue-green coloration. Natural occurrence includes native metallic copper and various sulfide, oxide, and carbonate mineral forms. Industrial applications exploit copper's conductivity, corrosion resistance, and alloy-forming capabilities across electrical, construction, and manufacturing sectors. Archaeological evidence indicates continuous human utilization for over 10,000 years, representing one of humanity's earliest metallurgical achievements.
Introduction
Copper occupies position 29 in the periodic table as the first element of the fourth period d-block transition metals. The element belongs to group 11 alongside silver and gold, characterized by completely filled d-orbitals and single s-orbital valence electrons. This electronic arrangement produces unique physical properties including exceptional electrical conductivity, thermal conductivity, and malleable mechanical characteristics. Copper represents the prototype coinage metal, demonstrating resistance to atmospheric corrosion while maintaining workability essential for technological applications.
Discovery of native copper deposits enabled early metallurgical development, with archaeological evidence documenting systematic copper utilization beginning approximately 8000 BC. The element's natural occurrence in unalloyed metallic form facilitated immediate technological adoption without requiring sophisticated extraction techniques. Subsequent development of copper smelting from sulfide ores around 5000 BC established copper as the foundation for Bronze Age metallurgy and technological advancement.
Physical Properties and Atomic Structure
Fundamental Atomic Parameters
Copper possesses atomic number 29 with electron configuration [Ar] 3d10 4s1, demonstrating complete d-orbital filling characteristic of group 11 elements. The atomic structure exhibits effective nuclear charge of approximately 6.1 for the 4s electron, resulting from nuclear charge shielding by inner electron shells. Atomic radius measures 128 pm in metallic coordination, while ionic radii vary with oxidation state: Cu+ exhibits 77 pm radius and Cu2+ demonstrates 73 pm radius in octahedral coordination.
Comparative analysis with neighboring elements reveals systematic trends in atomic properties. The d10 configuration produces diamagnetic behavior with magnetic susceptibility of -9.63×10-6 cm³/mol. Electronic structure governs chemical reactivity through availability of d-orbitals for coordination bonding and variable oxidation state stabilization.
Macroscopic Physical Characteristics
Copper exhibits distinctive reddish-orange metallic appearance in freshly exposed surfaces, attributed to characteristic optical absorption properties. The metal crystallizes in face-centered cubic structure with space group Fm3̄m and lattice parameter a = 361.49 pm. Crystal coordination demonstrates twelve nearest neighbors at equal distances, producing close-packed metallic bonding arrangement.
Thermodynamic phase behavior includes melting point 1084.62°C (1357.77 K) and boiling point 2562°C (2835 K). Heat of fusion measures 13.26 kJ/mol while heat of vaporization reaches 300.4 kJ/mol. Specific heat capacity equals 24.440 J/(mol·K) at standard conditions. Density at room temperature equals 8.96 g/cm³, placing copper among moderately dense transition metals. Thermal expansion coefficient measures 16.5 μm/(m·K) at 25°C, indicating moderate dimensional stability under temperature variation.
Chemical Properties and Reactivity
Electronic Structure and Bonding Behavior
Chemical reactivity derives from d10 electronic configuration enabling facile electron loss from 4s and 3d orbitals. Common oxidation states include +1 (cuprous) and +2 (cupric), with +3 and +4 states accessible under specific conditions. The Cu+ state demonstrates d10 configuration exhibiting stability in coordination complexes and solid compounds. Cupric Cu2+ state possesses d9 configuration producing characteristic Jahn-Teller distortion in octahedral coordination environments.
Coordination chemistry encompasses diverse ligand interactions with coordination numbers ranging from 2 to 6. Linear coordination characterizes Cu+ complexes, while Cu2+ typically adopts square planar or octahedral geometries with distortion. Bond formation involves d-orbital participation through crystal field stabilization and covalent character contribution. Copper-ligand bond lengths vary systematically with coordination environment: Cu-O bonds measure approximately 1.9-2.1 Å while Cu-N bonds range from 2.0-2.3 Å depending on ligand field strength.
Electrochemical and Thermodynamic Properties
Electronegativity measures 1.90 on the Pauling scale, positioning copper between transition metal extremes and indicating moderate electron-attracting capability. Successive ionization energies demonstrate increasing energy requirements: first ionization energy equals 745.5 kJ/mol, second ionization energy reaches 1957.9 kJ/mol, and third ionization energy requires 3555 kJ/mol. These values reflect electronic structure changes accompanying progressive electron removal.
Standard reduction potentials establish thermodynamic stability relationships for copper species. The Cu2+/Cu couple exhibits potential +0.337 V, while Cu+/Cu demonstrates +0.521 V versus standard hydrogen electrode. The Cu2+/Cu+ couple shows +0.153 V, indicating thermodynamic instability of Cu+ in aqueous solution through disproportionation: 2Cu+ → Cu2+ + Cu. Redox behavior varies significantly in different chemical environments, with complexation and pH effects modifying thermodynamic relationships.
Chemical Compounds and Complex Formation
Binary and Ternary Compounds
Copper forms extensive series of binary compounds across multiple anion types. Oxide formation produces Cu₂O (cuprous oxide) and CuO (cupric oxide) as principal species. Cuprous oxide adopts cubic crystal structure with Cu+ in linear coordination, while cupric oxide crystallizes in monoclinic structure with square planar copper coordination. Halide compounds include CuCl, CuBr, CuI for Cu+ state and CuCl₂, CuBr₂ for Cu2+ state.
Sulfide compounds demonstrate significant mineral importance with chalcocite Cu₂S and covellite CuS representing primary copper ore minerals. Formation mechanisms involve hydrothermal processes with temperature-dependent stability fields. Ternary compounds encompass sulfosalt minerals including chalcopyrite CuFeS₂ and bornite Cu₅FeS₄, demonstrating complex structural arrangements and mixed oxidation states.
Coordination Chemistry and Organometallic Compounds
Coordination complexes exhibit diverse geometric arrangements determined by d-electron count and ligand field effects. Cu+ complexes favor linear and tetrahedral coordination with d10 configuration providing kinetic lability. Cu2+ complexes adopt square planar, square pyramidal, or distorted octahedral geometries reflecting Jahn-Teller stabilization. Common ligands include ammonia, ethylenediamine, phenanthroline, and acetylacetonate with characteristic absorption spectra and magnetic properties.
Organometallic chemistry involves copper-carbon bond formation in various oxidation states. Cuprate reagents demonstrate synthetic utility in organic synthesis through conjugate addition and cross-coupling reactions. Copper-catalyzed reactions include alkyne coupling, amination, and etherification processes exploiting redox cycling between Cu+ and Cu3+ states. Bond characteristics include polarized Cu-C bonds with significant ionic character and moderate thermal stability.
Natural Occurrence and Isotopic Analysis
Geochemical Distribution and Abundance
Crustal abundance measures approximately 50 parts per million by weight, establishing copper as moderately abundant among transition metals. Geochemical behavior involves concentration through hydrothermal processes, producing economic deposits in porphyry, skarn, and volcanogenic massive sulfide environments. Copper exhibits chalcophile character, concentrating in sulfide phases during magmatic differentiation processes.
Distribution patterns reflect geological processes including metamorphic grade, weathering intensity, and secondary mineral formation. Supergene enrichment processes concentrate copper through oxidation and leaching mechanisms, producing secondary copper minerals including azurite Cu₃(CO₃)₂(OH)₂ and malachite Cu₂CO₃(OH)₂ in oxidized zones. Marine environments demonstrate low copper concentrations averaging 0.5 μg/L in seawater, while freshwater systems contain approximately 2 μg/L copper concentration.
Nuclear Properties and Isotopic Composition
Natural isotopic composition comprises two stable isotopes: 63Cu (69.15% abundance) and 65Cu (30.85% abundance). Both isotopes possess nuclear spin 3/2 with magnetic moments +2.2273 μN and +2.3817 μN respectively. Nuclear stability derives from favorable neutron-to-proton ratios within the valley of beta stability.
Radioisotopic species include 64Cu with 12.7-hour half-life exhibiting both β+ and β- decay modes. 67Cu demonstrates 2.58-day half-life through β- decay exclusively. These isotopes find applications in medical imaging and radiopharmaceutical research. Nuclear cross-sections for thermal neutron interactions measure 3.78 barns for 63Cu and 2.17 barns for 65Cu, enabling isotopic analysis through neutron activation techniques.
Industrial Production and Technological Applications
Extraction and Purification Methodologies
Industrial extraction predominantly utilizes sulfide ore processing through concentration and pyrometallurgical treatment. Froth flotation concentrates copper sulfides from gangue minerals, achieving typical concentrates containing 20-30% copper content. Flash smelting processes operate at temperatures exceeding 1200°C, converting concentrated sulfides to copper matte through controlled oxidation reactions.
Pyrometallurgical refining involves converting operations transforming copper matte to blister copper containing 98-99% purity. Electrorefining achieves final purification producing cathode copper with 99.99% purity through electrochemical deposition. Production statistics indicate annual global output approaching 23 million metric tons, with Chile, Peru, and China representing primary producing regions. Environmental considerations include sulfur dioxide emission control and acid mine drainage mitigation in extraction operations.
Technological Applications and Future Prospects
Electrical applications exploit copper's conductivity measuring 5.96×107 S/m, second only to silver among pure metals. Wire and cable manufacturing consumes approximately 60% of copper production, supporting power transmission and electronic device connectivity. Thermal conductivity of 401 W/(m·K) enables heat exchanger and cooling system applications in automotive, industrial, and residential sectors.
Alloy formation produces bronze, brass, and specialized compositions for marine, architectural, and precision instrument applications. Antimicrobial properties support healthcare and food processing uses through bacteriostatic mechanisms. Emerging technologies include renewable energy infrastructure, electric vehicle components, and advanced electronic systems requiring high-performance conductive materials. Economic significance reflects commodity market dynamics with pricing sensitivity to global supply-demand fluctuations and technological demand growth.
Historical Development and Discovery
Archaeological evidence documents copper utilization beginning approximately 8000 BC in Anatolia and the Middle East, representing humanity's earliest systematic metallurgy. Native copper deposits provided directly usable metal without requiring chemical reduction processes, enabling immediate technological adoption. The Chalcolithic period (Copper Age) demonstrates transitional phase between stone and bronze technologies, with copper tools and ornaments appearing throughout Mediterranean and Near Eastern civilizations.
Smelting technology development around 5000 BC enabled processing of copper sulfide ores, dramatically expanding available copper sources beyond native deposits. Casting techniques evolved around 4000 BC, allowing complex shape fabrication through molten metal manipulation. Bronze production beginning approximately 3500 BC represented first intentional alloy creation, combining copper with tin to produce superior mechanical properties. These metallurgical advances established copper as fundamental to technological progress through ancient, medieval, and modern periods.
Scientific understanding progressed through systematic investigation of copper chemistry during 18th and 19th centuries. Identification of cupric and cuprous oxidation states, crystal structure determination, and electronic theory development provided theoretical foundation for modern copper science. Contemporary research focuses on nanostructured copper materials, catalytic applications, and sustainable extraction technologies addressing environmental and resource sustainability challenges.
Conclusion
Copper maintains unique position among transition metals through combination of filled d-orbital electronic structure, exceptional transport properties, and diverse chemical reactivity. The element's significance extends across modern technological applications including renewable energy systems, electronic communications, and materials science innovations. Fundamental research continues investigating quantum effects in copper nanostructures, catalytic mechanisms in organic synthesis, and advanced alloy development. Future technological advancement will likely exploit copper's established properties while developing novel applications in emerging fields including quantum computing, energy storage, and sustainable materials engineering.

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