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Properties of SiS2

Properties of SiS2 (Silicon disulfide):

Compound NameSilicon disulfide
Chemical FormulaSiS2
Molar Mass92.2155 g/mol

Chemical structure
SiS2 (Silicon disulfide) - Chemical structure
Lewis structure
3D molecular structure
Physical properties
AppearanceWhite (samples are sometimes grey or brown) needles. Rotten egg smell in moist air.
Solubilityreacts
Density1.8530 g/cm³
Helium 0.0001786
Iridium 22.562
Melting1,090.00 °C
Helium -270.973
Hafnium carbide 3958

Alternative Names

silicon(IV) sulfide

Elemental composition of SiS2
ElementSymbolAtomic weightAtomsMass percent
SiliconSi28.0855130.4564
SulfurS32.065269.5436
Mass Percent CompositionAtomic Percent Composition
Si: 30.46%S: 69.54%
Si Silicon (30.46%)
S Sulfur (69.54%)
Si: 33.33%S: 66.67%
Si Silicon (33.33%)
S Sulfur (66.67%)
Mass Percent Composition
Si: 30.46%S: 69.54%
Si Silicon (30.46%)
S Sulfur (69.54%)
Atomic Percent Composition
Si: 33.33%S: 66.67%
Si Silicon (33.33%)
S Sulfur (66.67%)
Identifiers
CAS Number13759-10-9
SMILESS=[Si]=S
SMILESS=[Si](S0)S[Si]0(S0)S[Si]0(S0)S[Si]0(S0)S[Si]0(S0)S[Si]0(S0)S[Si]0=S
Hill formulaS2Si

Related compounds
FormulaCompound name
SiSSilicon monosulfide

Related
Molecular weight calculator
Oxidation state calculator

Silicon disulfide (SiS₂): Chemical Compound

Scientific Review Article | Chemistry Reference Series

Abstract

Silicon disulfide (SiS₂) represents an important inorganic polymeric compound with the chemical formula SiS₂ and molar mass of 92.218 g/mol. This material exhibits a one-dimensional polymeric structure consisting of chains of edge-shared silicon-sulfur tetrahedra. Silicon disulfide appears as white crystalline needles, though samples frequently display grey or brown discoloration due to impurities. The compound demonstrates a density of 1.853 g/cm³ and sublimes at 1090°C without melting. Silicon disulfide hydrolyzes readily in moist air, releasing hydrogen sulfide gas which produces a characteristic rotten egg odor. The compound finds applications in materials science and serves as a precursor to various thiosilicate compounds. Its structural relationship to silicon dioxide, while maintaining distinct polymeric architecture, makes it a subject of ongoing research interest in solid-state chemistry and materials development.

Introduction

Silicon disulfide constitutes an inorganic compound classified within the category of metal sulfides, specifically as a group IV sulfide alongside carbon disulfide, germanium disulfide, tin(IV) sulfide, and lead(IV) sulfide. Unlike its carbon analog, silicon disulfide adopts a polymeric structure rather than existing as discrete molecules. This structural distinction illustrates the divergent chemical behavior between second-period elements and their heavier congeners in the periodic table. The compound's discovery emerged from investigations into silicon-sulfur chemistry during the early 20th century, with significant structural characterization occurring through X-ray diffraction studies in the 1950s. Silicon disulfide occupies an important position in materials chemistry due to its structural relationship to silicon dioxide while exhibiting distinct chemical and physical properties arising from sulfur substitution.

Molecular Structure and Bonding

Molecular Geometry and Electronic Structure

Silicon disulfide exhibits a one-dimensional polymeric structure in its solid state, consisting of infinite chains of silicon atoms bridged by sulfur atoms. Each silicon center maintains tetrahedral coordination geometry with two bridging sulfur atoms, consistent with VSEPR theory predictions for silicon surrounded by four electron pairs. The repeating unit comprises -Si(μ-S)₂Si(μ-S)₂- connectivity, with silicon-sulfur bond lengths measuring approximately 2.15 Å. The electronic structure involves sp³ hybridization at silicon atoms, with formal oxidation state +4 for silicon and -2 for sulfur. Molecular orbital analysis reveals σ-bonding framework between silicon 3sp³ orbitals and sulfur 3p orbitals, with delocalized bonding character along the polymeric chain. The compound crystallizes in the orthorhombic crystal system with space group Ibam (No. 72) and Pearson symbol oI12, containing twelve formula units per unit cell.

Chemical Bonding and Intermolecular Forces

The primary chemical bonding in silicon disulfide consists of polar covalent silicon-sulfur bonds with approximately 30% ionic character based on electronegativity differences (Si: 1.90, S: 2.58). Bond dissociation energies for Si-S bonds range from 310-340 kJ/mol, slightly lower than typical Si-O bonds (452 kJ/mol) but higher than S-S bonds (226 kJ/mol). The polymeric structure creates a highly polar material with calculated molecular dipole moments of approximately 3.5 D per repeating unit along the chain direction. Intermolecular forces between chains primarily involve van der Waals interactions, with some contribution from dipole-dipole attractions due to the polar nature of Si-S bonds. The compound demonstrates limited hydrogen bonding capability despite its polarity, owing to the weak hydrogen bond acceptor capacity of sulfide centers compared to oxide analogs.

Physical Properties

Phase Behavior and Thermodynamic Properties

Silicon disulfide appears as white crystalline needles under pure conditions, though technical grade samples often exhibit grey or brown coloration due to elemental silicon or sulfur impurities. The compound possesses an orthorhombic crystal structure with density of 1.853 g/cm³ at 25°C. Silicon disulfide sublimes at 1090°C under atmospheric pressure without undergoing melting, indicating strong covalent bonding within the polymeric structure that persists until sublimation. The heat of sublimation measures approximately 125 kJ/mol, reflecting the energy required to break intermolecular forces while maintaining the polymeric chain integrity. Specific heat capacity values range from 0.75-0.85 J/g·K between 25-500°C, with thermal expansion coefficients of 4.2 × 10⁻⁵ K⁻¹ along the chain axis and 6.8 × 10⁻⁵ K⁻¹ perpendicular to the chains. The compound exhibits negligible vapor pressure below 800°C, increasing rapidly near the sublimation temperature.

Spectroscopic Characteristics

Infrared spectroscopy of silicon disulfide reveals characteristic vibrational modes including asymmetric Si-S stretching at 580-620 cm⁻¹, symmetric Si-S stretching at 450-480 cm⁻¹, and bending modes at 280-320 cm⁻¹. Raman spectroscopy shows strong bands at 595 cm⁻¹ and 465 cm⁻¹ corresponding to Si-S stretching vibrations, with weaker features at 310 cm⁻¹ and 225 cm⁻¹ associated with bending modes. Solid-state NMR spectroscopy demonstrates a single 29Si resonance at -15 to -20 ppm relative to TMS, consistent with tetrahedral silicon coordination environments. UV-Vis spectroscopy indicates a band gap of approximately 4.2 eV, with absorption onset at 295 nm corresponding to σ-σ* transitions within the Si-S bonding framework. Mass spectrometric analysis of sublimed material shows fragmentation patterns dominated by SiS⁺ (m/z 60) and SiS₂⁺ (m/z 92) ions, with minor contributions from S₂⁺ (m/z 64) and Si₂S₃⁺ (m/z 148) cluster ions.

Chemical Properties and Reactivity

Reaction Mechanisms and Kinetics

Silicon disulfide demonstrates high reactivity toward hydrolytic decomposition, reacting with atmospheric moisture to produce hydrogen sulfide and silicic acid according to the equation: SiS₂ + 2H₂O → SiO₂ + 2H₂S. This hydrolysis proceeds rapidly with observed rate constants of k = 2.3 × 10⁻³ s⁻¹ at 25°C and 50% relative humidity. The reaction follows first-order kinetics with respect to water concentration and exhibits an activation energy of 45 kJ/mol. Alcoholysis reactions proceed similarly, with ethanol yielding tetraethyl orthosilicate and hydrogen sulfide: SiS₂ + 4EtOH → Si(OEt)₄ + 2H₂S. With sterically hindered tert-butanol, the reaction produces tris(tert-butoxy)silanethiol: 3t-BuOH + SiS₂ → (t-BuO)₃SiSH + H₂S, demonstrating the influence of steric effects on reaction selectivity. Reaction half-lives in alcoholic solutions range from minutes to hours depending on alcohol structure and concentration.

Acid-Base and Redox Properties

Silicon disulfide behaves as a Lewis acid through silicon centers and as a Lewis base through sulfur centers. The compound reacts with sodium sulfide, magnesium sulfide, and aluminum sulfide to form various thiosilicate compounds including Na₂SiS₃, MgSiS₃, and Al₂(SiS₃)₃. These reactions demonstrate the compound's ability to function as a silicon electrophile toward sulfide nucleophiles. Redox properties include reduction to elemental silicon and hydrogen sulfide by strong reducing agents such as lithium aluminum hydride: SiS₂ + 2LiAlH₄ → Si + 2LiAlSH₄. Oxidation occurs slowly with atmospheric oxygen, forming silicon dioxide and sulfur dioxide: SiS₂ + 3O₂ → SiO₂ + 2SO₂, with reaction rates accelerating above 200°C. The compound exhibits stability in anhydrous inert atmospheres but decomposes rapidly in oxidizing or humid environments.

Synthesis and Preparation Methods

Laboratory Synthesis Routes

Laboratory synthesis of silicon disulfide typically proceeds through direct combination of elemental silicon and sulfur at elevated temperatures. The reaction requires heating stoichiometric mixtures of finely powdered silicon (99.5% purity) and sulfur (sublimed grade) to 1000-1100°C under vacuum or inert atmosphere. Reaction times vary from 4-12 hours depending on particle size and mixing efficiency, with yields typically reaching 85-90%. An alternative synthesis involves exchange reaction between silicon dioxide and aluminum sulfide: 3SiO₂ + 2Al₂S₃ → 3SiS₂ + 2Al₂O₃, conducted at 1100-1200°C under argon atmosphere. This method produces higher purity material but requires subsequent separation from aluminum oxide byproducts through sublimation or solvent extraction. Purification typically employs vacuum sublimation at 1000-1050°C with collection of the crystalline product in cooler regions of the apparatus. Analytical purity samples demonstrate white crystalline morphology with minimal elemental silicon or sulfur contamination.

Industrial Production Methods

Industrial production of silicon disulfide utilizes scaled versions of laboratory synthesis routes, typically employing the direct combination method due to its simpler process chemistry and lower raw material costs. Continuous reactor designs include rotary kilns and fluidized bed reactors operating at 1050-1150°C under nitrogen atmosphere. Process optimization focuses on particle size control (silicon: 5-20 μm, sulfur: 10-30 μm), stoichiometric precision (Si:S molar ratio 1:2.02-2.05), and reaction time minimization through efficient heat transfer. Production capacities range from laboratory-scale grams to industrial quantities of several hundred kilograms annually, with primary applications in specialty chemicals and materials research. Economic considerations favor the direct combination method despite slightly lower yields compared to exchange reactions, due to simpler purification requirements and reduced energy consumption. Environmental management strategies focus on containment of hydrogen sulfide byproducts through scrubbing systems and conversion to elemental sulfur.

Analytical Methods and Characterization

Identification and Quantification

Analytical identification of silicon disulfide employs multiple complementary techniques including X-ray diffraction, infrared spectroscopy, and elemental analysis. X-ray powder diffraction provides definitive identification through comparison to reference patterns (JCPDS 00-022-1307), with characteristic peaks at d-spacings of 3.42 Å (100%), 2.98 Å (80%), and 2.15 Å (60%). Infrared spectroscopy confirms identity through Si-S stretching vibrations at 580-620 cm⁻¹ and 450-480 cm⁻¹. Quantitative analysis utilizes gravimetric methods following hydrolysis and precipitation of silicon as silicon dioxide or determination of sulfur as barium sulfate. Detection limits for impurity analysis reach 0.1% for elemental silicon and sulfur through differential scanning calorimetry and microscopic examination. Chromatographic methods applied to hydrolysis products allow quantification of hydrogen sulfide evolution rates with precision of ±2% relative standard deviation.

Purity Assessment and Quality Control

Purity assessment of silicon disulfide focuses primarily on elemental silicon and sulfur contamination, hydrolysis resistance, and crystalline morphology. Standard specifications require less than 0.5% elemental silicon, determined by acid digestion and gravimetric analysis, and less than 0.3% free sulfur, measured by carbon disulfide extraction and spectrophotometric determination. Quality control parameters include sublimation temperature range (1085-1095°C), crystalline habit (acicular needles), and absence of discoloration. Stability testing protocols involve exposure to controlled humidity environments (50% RH, 25°C) with hydrogen sulfide evolution rates below 0.1 mL/g·h. Shelf life under anhydrous inert atmosphere exceeds two years without significant decomposition, while storage in air results in complete hydrolysis within days. Technical grade material permits higher impurity levels (up to 2% silicon, 1% sulfur) for applications less sensitive to contamination.

Applications and Uses

Industrial and Commercial Applications

Silicon disulfide serves primarily as a specialty chemical intermediate in the production of various sulfur-containing silicon compounds. Industrial applications include synthesis of thiosilicate glasses and ceramics through reaction with metal oxides, producing materials with unique optical and electrical properties. The compound functions as a sulfurizing agent in metallurgical processes, introducing sulfur into metal alloys at controlled concentrations. Commercial utilization extends to laboratory-scale synthesis of organosilicon compounds, particularly thiol-functionalized silanes unavailable through direct routes. Niche applications encompass high-temperature lubricants and additives where the compound's thermal stability and solid-state lubrication properties prove advantageous. Market demand remains limited to several metric tons annually, primarily serving research institutions and specialty chemical manufacturers. Economic significance derives from value-added products rather than direct consumption, with pricing reflecting high purity requirements and specialized handling needs.

Research Applications and Emerging Uses

Research applications of silicon disulfide focus on its structural analogy to silicon dioxide while possessing distinct chemical functionality. Materials science investigations explore its use as a precursor to silicon-sulfur ceramics and glasses with tailored properties including adjustable refractive indices and thermal expansion coefficients. Solid-state chemistry research employs the compound as a model system for one-dimensional covalent polymers, studying phonon propagation and thermal conductivity anisotropy. Emerging applications include potential use as a solid electrolyte precursor for sulfur-based battery systems, leveraging its high sulfur content and ionic conductivity upon appropriate chemical modification. Thin film deposition through chemical vapor deposition techniques produces silicon-sulfur coatings with potential optoelectronic applications. Patent activity remains limited but shows increasing interest in energy storage applications and specialty glass formulations containing sulfur as a network former.

Historical Development and Discovery

The discovery of silicon disulfide dates to early investigations into silicon-sulfur chemistry during the late 19th century, with initial reports appearing in German chemical literature around 1890. Early synthesis methods involved direct combination of elements but suffered from incomplete reactions and impurity issues. Structural characterization advanced significantly through X-ray diffraction studies conducted in the 1950s, which revealed the one-dimensional polymeric structure distinct from silicon dioxide. The 1960s brought improved understanding of its chemical behavior, particularly hydrolysis mechanisms and reactions with nucleophiles. Methodological advances in the 1970s enabled higher purity synthesis through vacuum sublimation techniques, facilitating more precise property measurements. Recent research focuses on computational modeling of its electronic structure and exploration of nanomaterials derived from its structural motif. The compound's historical development illustrates the progressive understanding of main group element chemistry beyond second-period elements.

Conclusion

Silicon disulfide represents a structurally unique inorganic polymer with significant chemical and materials science interest. Its one-dimensional tetrahedral network structure distinguishes it from both molecular disulfides and three-dimensional network solids like silicon dioxide. The compound exhibits high reactivity toward hydrolysis and nucleophilic attack, serving as a versatile synthetic intermediate for sulfur-containing silicon compounds. Physical properties including high thermal stability and anisotropic crystal habit derive from its covalent polymeric architecture. Current applications primarily involve specialty chemical synthesis, while emerging research explores potential uses in energy storage and advanced materials. Future research directions likely include nanostructured forms of silicon disulfide, computational modeling of its electronic properties, and development of composite materials leveraging its unique combination of silicon and sulfur chemistry. The compound continues to provide insights into structural and chemical relationships between oxygen and sulfur compounds of main group elements.

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