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Properties of FeSi

Properties of FeSi (Iron monosilicide):

Compound NameIron monosilicide
Chemical FormulaFeSi
Molar Mass83.9305 g/mol

Chemical structure
FeSi (Iron monosilicide) - Chemical structure
Lewis structure
3D molecular structure
Physical properties
Appearancegray cubic crystals
Density6.1000 g/cm³
Helium 0.0001786
Iridium 22.562
Melting1,410.00 °C
Helium -270.973
Hafnium carbide 3958

Alternative Names

Naquite, fersilicite
Iron silicide

Elemental composition of FeSi
ElementSymbolAtomic weightAtomsMass percent
IronFe55.845166.5372
SiliconSi28.0855133.4628
Mass Percent CompositionAtomic Percent Composition
Fe: 66.54%Si: 33.46%
Fe Iron (66.54%)
Si Silicon (33.46%)
Fe: 50.00%Si: 50.00%
Fe Iron (50.00%)
Si Silicon (50.00%)
Mass Percent Composition
Fe: 66.54%Si: 33.46%
Fe Iron (66.54%)
Si Silicon (33.46%)
Atomic Percent Composition
Fe: 50.00%Si: 50.00%
Fe Iron (50.00%)
Si Silicon (50.00%)
Identifiers
CAS Number12022-95-6
SMILES[Si].[Fe]
Hill formulaFeSi

Related compounds
FormulaCompound name
Fe2SiDiiron silicide
FeSi2Iron disilicide

Related
Molecular weight calculator
Oxidation state calculator

Iron monosilicide (FeSi): Chemical Compound

Scientific Review Article | Chemistry Reference Series

Abstract

Iron monosilicide (FeSi) represents an intermetallic compound with the chemical formula FeSi and molar mass of 83.931 grams per mole. This compound crystallizes in a cubic structure with space group P213 (No. 198) and exhibits chiral characteristics due to its non-centrosymmetric crystal arrangement. FeSi demonstrates semiconducting properties with a narrow band gap of 0.05 electronvolts (indirect) and 0.14 electronvolts (direct), resulting in room-temperature electrical resistivity around 10 kΩ·cm. The compound occurs naturally as the rare mineral naquite and displays unusual magnetic properties at low temperatures. Iron monosilicide serves as the prototype for the iron monosilicide structure type and finds applications in specialized electronic and magnetic devices.

Introduction

Iron monosilicide belongs to the class of intermetallic compounds known as transition metal silicides. These materials occupy a significant position in materials science due to their unique electronic and magnetic properties that bridge the gap between metallic conductors and conventional semiconductors. The compound exhibits a distinctive chiral crystal structure that lacks inversion symmetry, resulting in intriguing physical properties that have attracted sustained scientific interest since its structural characterization in the mid-20th century. Linus Pauling's 1948 investigation of the chemical bonding in FeSi established fundamental understanding of its electronic structure.

Molecular Structure and Bonding

Molecular Geometry and Electronic Structure

Iron monosilicide crystallizes in a cubic structure with space group P213 (No. 198) and Pearson symbol cP8. The unit cell contains four formula units with lattice constant a = 0.44827(1) nanometers. The structure derives from the sodium chloride prototype but with significant atomic displacements along the ⟨111⟩ directions. Iron atoms occupy positions with parameter x = 0.13652 while silicon atoms occupy positions with parameter y = 0.8424 (equivalent to -0.1576). These displacements eliminate all mirror planes and inversion centers, resulting in chiral crystals that exist in two distinct enantiomorphic forms.

The coordination environment around each iron atom involves seven silicon neighbors at varying distances, creating a distorted seven-coordinate geometry. Similarly, each silicon atom resides within a cage of seven iron atoms. The threefold rotational symmetry of these coordination polyhedra creates helical arrangements along the ⟨111⟩ directions. The electronic structure features hybridization between iron 3d orbitals and silicon 3p orbitals, creating a narrow band gap semiconductor with complex electronic properties.

Chemical Bonding and Intermolecular Forces

The chemical bonding in iron monosilicide exhibits mixed metallic-covalent character typical of intermetallic compounds. Pauling's analysis revealed partial ionic character with estimated bond lengths consistent with the observed interatomic distances. The shortest Fe-Si bonds measure approximately 0.230 nanometers, while the longest approach 0.240 nanometers. These variations in bond length reflect the complex electronic structure and charge distribution within the crystal.

The compound demonstrates primarily metallic bonding characteristics with directional covalent contributions. The absence of inversion symmetry creates permanent electric dipole moments that influence the material's electronic properties. Intermolecular forces in the solid state are dominated by metallic bonding interactions, with negligible van der Waals contributions due to the extended nature of the metallic electron cloud.

Physical Properties

Phase Behavior and Thermodynamic Properties

Iron monosilicide appears as gray cubic crystals with density of 6.1 grams per cubic centimeter. The compound melts congruently at 1410°C without decomposition. The high melting point reflects the strong interatomic bonding characteristic of intermetallic compounds. Thermal expansion measurements show anisotropic behavior consistent with the cubic crystal structure.

The magnetic susceptibility exhibits unusual temperature dependence, with a maximum around 50 K followed by decrease at lower temperatures. The room-temperature magnetic susceptibility measures 8.5 × 10-6 electromagnetic units per gram. Specific heat measurements reveal enhanced electronic contributions at low temperatures, consistent with the narrow band gap semiconductor behavior.

Spectroscopic Characteristics

Infrared spectroscopy of FeSi reveals absorption features corresponding to phonon modes characteristic of the non-centrosymmetric structure. The vibrational spectrum shows modes between 200 and 400 cm-1 associated with Fe-Si stretching vibrations. Raman spectroscopy demonstrates characteristic peaks at 195, 285, and 395 cm-1 that serve as fingerprints for the compound.

Photoelectron spectroscopy measurements confirm the semiconducting nature with valence band maximum located approximately 0.1 electronvolts below the Fermi level. X-ray diffraction analysis provides precise determination of the atomic positions and thermal parameters, confirming the chiral structure with high reliability factors.

Chemical Properties and Reactivity

Reaction Mechanisms and Kinetics

Iron monosilicide demonstrates high chemical stability under ambient conditions, resisting oxidation in air up to approximately 400°C. Above this temperature, gradual oxidation occurs with formation of iron oxides and silicon dioxide. The oxidation kinetics follow parabolic rate laws indicative of diffusion-controlled processes through the growing oxide layer.

The compound exhibits resistance to most aqueous acids at room temperature, with dissolution rates below 0.01 millimeters per year in dilute hydrochloric and sulfuric acids. Alkaline solutions cause slight surface etching through silicon dissolution mechanisms. Reaction with halogens proceeds slowly at room temperature but accelerates substantially above 200°C with formation of iron halides and silicon tetrahalides.

Acid-Base and Redox Properties

Iron monosilicide functions as a weak reducing agent in chemical reactions, with standard reduction potential estimated at -0.3 volts relative to the standard hydrogen electrode. The compound demonstrates amphoteric character in extreme environments, reacting with both strong oxidizing agents and powerful reductants under appropriate conditions.

Electrochemical measurements indicate semiconductor-electrolyte interface behavior characteristic of narrow band gap materials. The flatband potential occurs at approximately -0.5 volts versus saturated calomel electrode in neutral aqueous solutions. Photoelectrochemical studies reveal limited photocurrent generation due to the small band gap and rapid recombination processes.

Synthesis and Preparation Methods

Laboratory Synthesis Routes

Laboratory synthesis of phase-pure iron monosilicide typically employs direct reaction of elemental iron and silicon in stoichiometric 1:1 ratio. The reaction proceeds according to the equation: Fe + Si → FeSi. The process requires high temperatures exceeding 1000°C to ensure complete reaction and homogeneous product formation.

Standard preparation involves sealing purified iron powder (99.99%) and silicon pieces (99.999%) in evacuated quartz ampoules. The sealed ampoules undergo gradual heating to 1100°C over 24 hours, maintained at this temperature for 72 hours, followed by slow cooling at rates not exceeding 5°C per hour. This annealing process ensures formation of large, well-ordered crystals suitable for physical property measurements.

Industrial Production Methods

Industrial production of iron monosilicide utilizes arc melting or induction melting techniques applied to iron-silicon mixtures. The process typically employs less pure starting materials (98-99% purity) with subsequent purification through zone refining or chemical vapor transport methods. Production scales remain relatively small due to specialized applications.

Chemical vapor transport using iodine as transporting agent enables growth of high-quality single crystals. The transport reaction proceeds according to: FeSi(s) + I2(g) ⇌ FeI2(g) + SiI2(g), with crystal growth occurring at temperature gradients between 950°C and 850°C. This method produces crystals up to several millimeters in dimension with excellent structural perfection.

Analytical Methods and Characterization

Identification and Quantification

X-ray diffraction provides the most reliable identification method for iron monosilicide, with characteristic reflections at d-spacings of 0.259 nm (111), 0.224 nm (200), 0.183 nm (210), and 0.158 nm (211). Quantitative phase analysis utilizes Rietveld refinement methods with typical reliability factors below 5% for well-crystallized samples.

Electron probe microanalysis confirms stoichiometry with detection limits of approximately 0.1 atomic percent for both iron and silicon. Energy-dispersive X-ray spectroscopy provides rapid qualitative identification with characteristic Fe-L and Si-K emission lines. Wavelength-dispersive spectroscopy enables precise quantitative analysis with accuracy better than 0.5 atomic percent.

Purity Assessment and Quality Control

Phase purity assessment employs combined X-ray diffraction and metallographic techniques. Common impurities include elemental silicon, iron disilicide (FeSi2), and various iron oxides. Optical microscopy reveals secondary phases through differences in reflectivity and etching behavior.

Electrical resistivity measurements serve as sensitive indicators of crystal quality, with low-temperature resistivity ratios (ρ300K4.2K) exceeding 100 for high-purity single crystals. Hall effect measurements provide additional characterization of electronic quality through carrier concentration and mobility determination.

Applications and Uses

Industrial and Commercial Applications

Iron monosilicide finds limited industrial application in specialized thermoelectric devices exploiting its unusual electronic properties. The compound's high Seebeck coefficient (approximately 200 microvolts per kelvin at room temperature) combined with moderate electrical conductivity creates favorable thermoelectric performance in certain temperature ranges.

The material serves as a prototype system for studying narrow-band gap semiconductors with strong electron correlations. Research applications include fundamental investigations of Kondo insulator behavior and non-Fermi liquid properties at low temperatures. The chiral crystal structure enables studies of relationship between structural chirality and electronic properties.

Research Applications and Emerging Uses

Recent research explores iron monosilicide in spintronic applications leveraging the combination of semiconducting behavior and magnetic properties. The non-centrosymmetric structure creates potential for spin-polarized carrier injection and detection. Theoretical investigations suggest possible topological insulator behavior under certain conditions.

Thin film deposition techniques including molecular beam epitaxy and sputtering enable fabrication of FeSi heterostructures for device applications. Epitaxial growth on silicon substrates demonstrates lattice matching conditions favorable for integrated device fabrication. These developments suggest potential integration with conventional semiconductor technology.

Historical Development and Discovery

The discovery of iron monosilicide as a distinct compound dates to early investigations of iron-silicon phase equilibria in the late 19th century. Systematic phase diagram studies in the 1920s established the existence of the FeSi phase with narrow homogeneity range. The compound's crystal structure determination occurred through X-ray diffraction studies in the 1930s, revealing the chiral cubic arrangement.

Linus Pauling's 1948 analysis of chemical bonding provided the first theoretical framework for understanding the compound's properties. The subsequent discovery of unusual magnetic behavior in the 1960s stimulated renewed interest, particularly regarding the relationship between crystal structure and electronic properties. Recent advances in crystal growth and characterization techniques have enabled detailed investigations of the compound's fundamental properties.

Conclusion

Iron monosilicide represents a structurally and electronically complex intermetallic compound with unique properties arising from its chiral crystal structure and narrow band gap semiconductor character. The material serves as a prototype system for understanding relationships between crystal symmetry, electronic structure, and physical properties in intermetallic phases. Ongoing research continues to reveal new aspects of its behavior, particularly regarding correlation effects and potential applications in emerging technologies. The compound's combination of semiconductor and metallic characteristics provides a rich platform for fundamental studies and potential technological applications in specialized electronic devices.

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