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Properties of CuS

Properties of CuS (Copper(II) sulfide):

Compound NameCopper(II) sulfide
Chemical FormulaCuS
Molar Mass95.611 g/mol

Chemical structure
CuS (Copper(II) sulfide) - Chemical structure
Lewis structure
3D molecular structure
Physical properties
Appearanceblack powder or lumps
Solubility0.00033 g/100mL
Density4.7600 g/cm³
Melting500.00 °C

Alternative Names

Covellite
Copper(II) sulfide
Cupric sulfide
Copper sulfide

Elemental composition of CuS
ElementSymbolAtomic weightAtomsMass percent
CopperCu63.546166.4631
SulfurS32.065133.5369
Mass Percent CompositionAtomic Percent Composition
Cu: 66.46%S: 33.54%
Cu Copper (66.46%)
S Sulfur (33.54%)
Cu: 50.00%S: 50.00%
Cu Copper (50.00%)
S Sulfur (50.00%)
Mass Percent Composition
Cu: 66.46%S: 33.54%
Cu Copper (66.46%)
S Sulfur (33.54%)
Atomic Percent Composition
Cu: 50.00%S: 50.00%
Cu Copper (50.00%)
S Sulfur (50.00%)
Identifiers
CAS Number1317-40-4
SMILES[Cu]=S
Hill formulaCuS

Related compounds
FormulaCompound name
Cu2SCopper(i) sulfide

Sample reactions for CuS
EquationReaction type
CuS + O2 = CuO + SO2double replacement
CuS + O2 = Cu + SO2single replacement
CuS + O2 = Cu2O + SO2double replacement
Fe + CuS = FeS + Cusingle replacement
Zn + CuS = ZnS + Cusingle replacement

Related
Molecular weight calculator
Oxidation state calculator

Copper monosulfide (CuS): Chemical Compound

Scientific Review Article | Chemistry Reference Series

Abstract

Copper monosulfide (CuS) represents a significant binary compound in the copper-sulfur system with distinctive structural and electronic properties. This inorganic compound crystallizes in the hexagonal crystal system with space group P63/mmc and exhibits a complex bonding arrangement featuring both tetrahedrally and trigonally coordinated copper atoms alongside disulfide (S22-) units. The compound demonstrates semiconducting behavior with an electrical conductivity of approximately 10-3 S·cm-1 at room temperature. Copper monosulfide manifests as a black powder or crystalline material with a density of 4.76 g·cm-3 and decomposes above 500°C rather than melting congruently. Its extremely low solubility product constant of 6×10-37 facilitates precipitation from aqueous solutions, making it valuable in analytical chemistry and materials science applications.

Introduction

Copper monosulfide (CuS) occupies a distinctive position in inorganic chemistry due to its unusual electronic structure and bonding characteristics. Historically identified as the mineral covellite, this compound was initially mischaracterized as containing copper in the +2 oxidation state. Advanced structural and spectroscopic analyses have revealed a more complex electronic configuration where all copper atoms exist in the +1 oxidation state, contrary to simple valence expectations. The compound belongs to the broader class of metal chalcogenides and demonstrates properties intermediate between typical semiconductors and metallic conductors. Industrial interest in copper monosulfide stems from its potential applications in photovoltaic devices, catalysis, and as a precursor for nanomaterials synthesis. The compound's unique structural features continue to attract research attention for fundamental studies in solid-state chemistry and materials science.

Molecular Structure and Bonding

Molecular Geometry and Electronic Structure

The crystal structure of copper monosulfide adopts the hexagonal covellite structure with space group P63/mmc and unit cell parameters a = 3.796 Å and c = 16.36 Å. The unit cell contains six formula units (12 atoms) arranged in a layered structure. Four copper atoms exhibit tetrahedral coordination with Cu-S bond lengths ranging from 2.19 Å to 2.32 Å, while two copper atoms demonstrate trigonal planar coordination with Cu-S distances of approximately 2.19 Å. The sulfur atoms exist in two distinct environments: two pairs form disulfide units with S-S bond distances of 2.07 Å, while the remaining sulfur atoms coordinate to five copper atoms in a pentagonal bipyramidal arrangement. X-ray photoelectron spectroscopy studies confirm that all copper atoms possess a formal oxidation state of +1, contradicting earlier formulations that proposed mixed valence states. The electronic structure features delocalized valence holes rather than radical anions, with the disulfide units playing a crucial role in charge distribution.

Chemical Bonding and Intermolecular Forces

The bonding in copper monosulfide represents a complex interplay of covalent, ionic, and metallic character. Copper-sulfur bonds exhibit primarily covalent character with bond energies estimated between 200-250 kJ·mol-1. The disulfide units (S22-) contribute significantly to the electronic structure through σ and π bonding interactions. The compound demonstrates diamagnetic behavior, inconsistent with the presence of Cu2+ ions, supporting the formulation as (Cu+)3(S2-)(S2)-. Interlayer interactions consist primarily of van der Waals forces with an interlayer spacing of approximately 3.5 Å. The compound's layered structure facilitates anisotropic properties, with electrical conductivity higher within layers than between them. The molecular dipole moment is negligible due to the centrosymmetric nature of the crystal structure.

Physical Properties

Phase Behavior and Thermodynamic Properties

Copper monosulfide appears as a black crystalline powder or lustrous blue-black crystals when well-formed. The compound decomposes at temperatures above 500°C rather than undergoing congruent melting, with decomposition products including copper metal and sulfur vapors. The density measures 4.76 g·cm-3 at 298 K. The specific heat capacity at constant pressure measures approximately 0.45 J·g-1·K-1 near room temperature. The compound exhibits extremely low solubility in water (3.3×10-7 g·L-1 at 18°C) corresponding to a solubility product constant of 6×10-37. It demonstrates solubility in nitric acid, ammonium hydroxide, and potassium cyanide solutions but remains insoluble in hydrochloric and sulfuric acids. The magnetic susceptibility measures -2.0×10-6 cm3·mol-1, consistent with diamagnetic behavior. The refractive index averages 1.45 across the visible spectrum.

Spectroscopic Characteristics

Infrared spectroscopy reveals characteristic S-S stretching vibrations between 470-480 cm-1 and Cu-S stretching modes in the 250-350 cm-1 region. Raman spectroscopy shows strong bands at 474 cm-1 corresponding to the S-S stretching vibration of disulfide units. UV-Vis spectroscopy demonstrates broad absorption across the visible spectrum with an absorption edge near 700 nm corresponding to a band gap of approximately 1.8 eV. X-ray photoelectron spectroscopy shows Cu 2p3/2 binding energy at 932.5 eV and S 2p binding energy at 162.0 eV, consistent with Cu+ and S2-/S22- species. Electron paramagnetic resonance studies confirm the absence of paramagnetic centers, supporting the diamagnetic nature of the compound.

Chemical Properties and Reactivity

Reaction Mechanisms and Kinetics

Copper monosulfide demonstrates moderate stability in dry air but undergoes gradual oxidation in moist air to form copper sulfate and elemental sulfur. The compound reacts with strong oxidizing agents such as nitric acid to produce copper nitrate and elemental sulfur or sulfate species depending on concentration and temperature. Reaction with hydrogen at elevated temperatures (300-400°C) produces copper metal and hydrogen sulfide with an activation energy of approximately 85 kJ·mol-1. The compound functions as a catalyst for various organic transformations including hydrogenation and desulfurization reactions. Decomposition kinetics follow first-order behavior with respect to sulfur pressure, with an activation energy for decomposition of 120 kJ·mol-1. The compound exhibits photochemical activity under visible light illumination, facilitating redox reactions at its surface.

Acid-Base and Redox Properties

Copper monosulfide behaves as a weak Lewis acid, capable of coordinating with soft Lewis bases through sulfur atoms. The compound demonstrates stability across a wide pH range (pH 4-10) in aqueous suspensions but undergoes disproportionation in strongly acidic media to form copper metal and hydrogen sulfide. The standard reduction potential for the CuS/Cu couple measures approximately +0.59 V versus the standard hydrogen electrode. Electrochemical studies show quasi-reversible redox behavior with oxidation peaks near +0.8 V and reduction peaks near +0.4 V versus Ag/AgCl in neutral media. The compound exhibits n-type semiconductor behavior with a flat-band potential of -0.2 V versus normal hydrogen electrode at pH 7. Surface oxidation occurs readily upon exposure to oxidizing agents, forming a thin layer of copper sulfate or oxide species.

Synthesis and Preparation Methods

Laboratory Synthesis Routes

The most common laboratory synthesis involves bubbling hydrogen sulfide gas through aqueous solutions of copper(II) salts such as copper sulfate or copper nitrate. This method produces a black colloidal precipitate of copper monosulfide according to the reaction: Cu2+(aq) + H2S(g) → CuS(s) + 2H+(aq). The precipitation typically occurs at room temperature with quantitative yields exceeding 95%. Alternative synthetic routes include the direct reaction of elemental copper with molten sulfur at temperatures between 200-300°C, followed by purification through sublimation or recrystallization. A solution-based method employs the reaction of copper(II) chloride in anhydrous ethanol with hydrogen sulfide, producing crystalline material suitable for single-crystal studies. The metathesis reaction between sodium sulfide and copper sulfate in aqueous solution provides another reliable synthetic pathway, though careful control of stoichiometry and pH is required to prevent formation of other copper sulfide phases.

Industrial Production Methods

Industrial production of copper monosulfide typically employs high-temperature methods rather than precipitation techniques. The direct reaction of copper metal with sulfur vapor at controlled temperatures between 400-500°C produces technical-grade material with purity levels of 95-98%. Large-scale production often utilizes byproducts from copper smelting operations, where copper monosulfide forms during the cooling of copper-sulfur melts. Industrial purification involves fractional crystallization or zone refining to achieve purities exceeding 99.5% for electronic applications. Economic considerations favor processes that utilize waste streams from copper refining, with production costs primarily determined by energy consumption during high-temperature processing. Environmental management focuses on containment of sulfur dioxide emissions and recovery of valuable byproducts.

Analytical Methods and Characterization

Identification and Quantification

X-ray diffraction provides the most definitive identification method through comparison of experimental patterns with the standard covellite reference pattern (JCPDS 06-0464). Characteristic diffraction peaks occur at d-spacings of 3.06 Å (100), 2.82 Å (004), 2.74 Å (101), and 1.90 Å (110). Quantitative analysis typically employs atomic absorption spectroscopy or inductively coupled plasma optical emission spectroscopy following dissolution in nitric acid/hydrogen peroxide mixtures. Detection limits for copper determination approach 0.1 mg·L-1 with relative standard deviations of 1-2%. X-ray photoelectron spectroscopy serves to confirm oxidation states through examination of Cu 2p and S 2p core level spectra, with particular attention to the absence of shake-up satellites characteristic of Cu2+ species.

Purity Assessment and Quality Control

Purity assessment typically involves combination of gravimetric, spectroscopic, and chromatographic methods. Thermogravimetric analysis under inert atmosphere monitors mass loss corresponding to sulfur evolution, with pure CuS exhibiting a mass loss of 33.6% upon complete decomposition to copper metal. Impurity profiling via mass spectrometry identifies common contaminants including iron, zinc, and silver substitutions at levels typically below 0.1%. Industrial specifications require copper content between 66.0-66.5% and sulfur content between 33.5-34.0%, with heavy metal impurities limited to less than 0.01%. Stability testing indicates no significant degradation under inert atmosphere at temperatures below 200°C, though surface oxidation occurs upon prolonged air exposure.

Applications and Uses

Industrial and Commercial Applications

Copper monosulfide finds application as a catalyst in petroleum refining processes, particularly in hydrodesulfurization reactions where it promotes sulfur removal from organic compounds. The compound serves as a precursor for copper sulfide nanomaterials, which exhibit quantum confinement effects and tunable band gaps for optoelectronic applications. In the pigment industry, copper monosulfide provides a stable black colorant for ceramics and plastics. The compound's semiconducting properties enable its use in photovoltaic devices, particularly as a component in thin-film solar cells where it functions as a p-type absorber layer. Electrochemical applications include use in lithium-ion batteries as cathode material, leveraging its reversible lithium insertion/extraction capabilities. The compound also finds use in chemical sensing applications due to its selective reactivity with various gaseous species.

Research Applications and Emerging Uses

Current research explores copper monosulfide as a component in thermoelectric materials, where its layered structure and anisotropic thermal conductivity offer potential for enhanced thermoelectric figures of merit. Investigations into photocatalytic applications focus on its visible light absorption and charge transfer properties for water splitting and environmental remediation. Nanostructured forms of copper monosulfide, including quantum dots and two-dimensional nanosheets, demonstrate unique electronic and optical properties for applications in photodetectors and light-emitting devices. Research into superconducting properties continues, particularly in doped variants and under high-pressure conditions. The compound's nonlinear optical properties receive attention for potential applications in photonic devices and optical limiting systems.

Historical Development and Discovery

The identification of copper monosulfide dates to the early 19th century with the characterization of the mineral covellite from Vesuvius volcanic deposits. Initial chemical analyses during the 1820s suggested the formula CuS, though controversy persisted regarding the oxidation state of copper. X-ray crystallographic studies in the 1920s revealed the unusual structure containing disulfide units, challenging conventional valence concepts. The diamagnetic behavior observed in the 1930s contradicted expectations for a Cu2+ compound, prompting revised bonding descriptions. The development of X-ray photoelectron spectroscopy in the 1960s provided definitive evidence for the Cu+ oxidation state, resolving long-standing controversies. Recent advances in computational chemistry have enabled detailed understanding of the electronic structure and bonding, particularly through density functional theory calculations that reproduce the unusual properties.

Conclusion

Copper monosulfide represents a chemically complex and technologically relevant compound with unusual structural and electronic characteristics. Its hexagonal crystal structure featuring disulfide units and mixed copper coordination environments continues to interest solid-state chemists and materials scientists. The compound's semiconducting properties, combined with its stability and processability, make it suitable for various applications in catalysis, energy conversion, and electronic devices. Ongoing research focuses on nanostructured forms and composite materials that leverage its unique properties. Fundamental questions remain regarding the precise nature of charge delocalization and the compound's behavior under extreme conditions. Future developments will likely exploit these properties for advanced technological applications while continuing to refine our understanding of its chemical bonding.

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